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Production Capability |
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|
No. |
Items |
Technical Capabilities |
|
1 |
PCB and Layers |
Rigid PCB, Rigid - Flex PCB, 2-20 layers |
|
2 |
Materials |
FR4, FR5, High Tg, CEM3, Rogers, Aluminum Base |
|
3 |
Surface |
HAL, Lead Free Hal, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, Gold Fingers, OSP |
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4 |
Max Board Size |
450 mm ¡Á1200 mm |
|
5 |
Min Board Thickness |
4 Layers: 0.4mm(16mil) |
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6 Layers: 0.8mm(32mil) |
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8 Layers: 1.2 mm (48mil) |
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10 Layers: 1.6mm (64mil) |
|
6 |
Min Line Width |
0.10mm (4mil) |
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7 |
Min Line Spacing |
0.10mm (4mil) |
|
8 |
Min Hole Size |
0.20mm (8mil) (Also Blind/Buried holes) |
|
9 |
PTH Hole Size Tolerance |
¡À0.076mm (¡À3mil) |
|
10 |
NPTH Hole Size Tolerance |
¡À0.05mm (¡À2mil) |
|
11 |
Hole Position Tolerance |
¡À0.05mm (¡À2mil) |
|
12 |
Min S/M Pitch |
0.10mm (4mil) |
|
13 |
Twist and Bent |
¡Ü0.75% |
|
14 |
Aspect Ratio |
12:1 |
|
15 |
Electric Strength |
¡Ý30KV / mm |
|
16 |
Peel Strength |
¡Ý1.4 N / mm |
|
17 |
Solder Mask Abrasion |
¡Ý6 H |
|
18 |
Thermal Stress |
288¡æ/20Sec. |
|
19 |
Flammability |
94V¡ª0 |
|
20 |
Test Voltage |
50-300 V |
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